System Introduction
Ensuring the quality between the ball bond and pad contact on the wire bonding process, the QC personnel make destructive inspections on several positions when setting up the production line. The inspection uses manually inspected by a microscope, which combines several pictures in different heights and calculates the contact surface. The whole process can take hours.
Newjob’s IMC Coverage judge system can do auto focusing and calibration which shortens the QC time.
Machine architecture
Handle the Photographing Combination
- After MAP took the pictures, pick the photographing point which will automatically moved to the point and OM takes the pictures.
- OM single point picturing of all Z axis position combine to take a clear picture.
- Dimension calibration plate can be provided