Laser machining equipment
Applicable for the semiconductor industry, cooperate development, university research labs
The laser machining equipment from Newjob Science Technology are applicable for:
Semiconductor and photoelectricity industry
Silicon wafer dicing/drilling
semiconductor wafer cutting
Laser marking/etching
Low-K wafer slotting
Chemical compound
Laser Debonding
Laser removal bonding
Laser annealing
Laser stripping
Laser large amount transfer
Laser glass welding
Soft material PI substrate punching and cutting
Laboratory Development
Special Machining-High Diameter Depth Ratio Drilling/Cutting
Arbitrarily material surface handling
Arbitrarily material micron structure forming
Customer made crafts development